14F1 Electroplated Diamond Grinding Wheel 150mm D91 Sharp Protruding Grain Low Cutting Resistance Stable Processing

Product Overview

The 14F1 Electroplated Diamond Grinding Wheel 150mm D91 is an advanced abrasive solution featuring a uniquely engineered single-layer electroplated diamond structure. By depositing diamond particles directly onto the substrate surface through precision electroplating, each grain achieves maximum protrusion height and retains its naturally sharp cutting edge — delivering unmatched performance in low-resistance, high-stability grinding operations.

Key Advantages

Electroplated Monolayer Structure with Sharp Protruding Grains

Our proprietary electroplating process fixes diamond particles in a precisely controlled single layer on the tool substrate. Unlike conventional multi-layer or resin-bonded wheels, this structure ensures each abrasive grain is fully exposed and permanently anchored:

Three Critical Operational Benefits

1. Lower Cutting Resistance
   The highly protruding diamond grains with naturally sharp cutting edges engage the workpiece with significantly reduced resistance. This results in lower spindle load, reduced heat generation at the grinding interface, and extended machine service life. Operators consistently report smoother feed rates and noticeably reduced vibration levels compared to conventional grinding wheels.

2. More Stable Processing
   The electroplated single-layer structure eliminates the variability inherent in multi-layer bonded abrasives. Each diamond grain remains firmly fixed to the substrate, providing unchanging cutting geometry throughout the wheel's service life. This stability is critical for automated production environments where process consistency directly determines product yield and quality.

3. Reduced Edge Chipping Risk
   Edge chipping is one of the most prevalent and expensive defects when grinding brittle materials. The sharp, precise cutting action of our electroplated diamond wheel minimizes lateral impact forces on workpiece edges, substantially reducing chip formation probability. For applications including glass edge profiling, ceramic substrate dicing, and semiconductor wafer processing, this translates directly to higher yield rates and lower scrap costs.

Technical Specifications

• Wheel Shape: 14F1 (Cup wheel for surface and edge grinding)
• Diameter: 150mm
• Grit Size: D91 (fine-medium grit for smooth surface finish)
• Bond Type: Electroplated nickel, single layer diamond
• Arbor Hole: 20mm standard
• Max Operating Speed: 4500 RPM
• Abrasive Material: High-grade synthetic diamond

Recommended Applications

• Glass edge grinding and chamfering with reduced chipping
• Quartz and sapphire window profiling for optical components
• Technical ceramic surface finishing for semiconductor equipment parts
• Precision grinding of silicon wafers and substrates
• Laboratory sample preparation for material characterization

Quality Commitment

Each 14F1 electroplated diamond grinding wheel is manufactured under strict ISO 9001:2015 quality management standards. Our process control spans every stage — from diamond selection and grading through electroplating parameter optimization to final dimensional and balance inspection. This ensures every wheel delivers the reliable, high-precision performance our customers depend on.

Contact our application engineering team to discuss your specific material processing requirements. We offer customized grit sizes, dimensions, and configurations tailored to your grinding application.